Nvidia will be thrilled – Samsung’s archrival announces it has begun production of HBM3E that will be used in Blackwell Ultra GPUs
South Korean memory giant SK Hynix has announced it has begun the mass production of the world’s first 12-layer HBM3E, featuring a total memory capacity of 36GB, a huge increase from the previous 24GB capacity in the 8-layer configuration.
This new design was made possible by reducing the thickness of each DRAM chip by 40%, allowing more layers to be stacked while maintaining the same overall size. The company plans to start volume shipments by the end of 2024.
The HBM3E memory supports a bandwidth of 9600 MT/s, translating to an effective speed of 1.22 TB/s if used in an eight-stack configuration. The improvement makes it ideal for handling LLMs and AI workloads that require both speed and high capacity. The ability to process more data at faster rates enables AI models to run more efficiently.
Nvidia and AMD hardware
For advanced memory stacking, SK Hynix employs innovative packaging technologies, including Through Silicon Via (TSV) and the Mass Reflow Molded Underfill (MR-MUF) process. These methods are essential for maintaining the structural integrity and heat dissipation required for stable, high-performance operation in the new HBM3E. The improvements in heat dissipation performance are particularly important for maintaining reliability during intensive AI processing tasks.
In addition to its increased speed and capacity, the HBM3E is designed to offer enhanced stability, with SK Hynix’s proprietary packaging processes ensuring minimal warpage during stacking. The company’s MR-MUF technology allows for better management of internal pressure, reducing the chances of mechanical failures and ensuring long-term durability.
Early sampling for this 12-layer HBM3E product began in March 2024, with Nvidia’s Blackwell Ultra GPUs and AMD’s Instinct MI325X accelerators expected to be among the first to use this enhanced memory, taking advantage of up to 288GB of HBM3E to support complex AI computations. SK Hynix recently rejected a $374 million advanced payment from an unknown company to ensure it could provide Nvidia with enough HMB for its in-demand AI hardware.
“SK Hynix has once again broken through technological limits demonstrating our industry leadership in AI memory,” said Justin Kim, President (Head of AI Infra) at SK Hynix. “We will continue our position as the No.1 global AI memory provider as we steadily prepare next-generation memory products to overcome the challenges of the AI era.”
Sign up to the TechRadar Pro newsletter to get all the top news, opinion, features and guidance your business needs to succeed!
More from TechRadar Pro
South Korean memory giant SK Hynix has announced it has begun the mass production of the world’s first 12-layer HBM3E, featuring a total memory capacity of 36GB, a huge increase from the previous 24GB capacity in the 8-layer configuration. This new design was made possible by reducing the thickness of…
Recent Posts
Archives
- November 2024
- October 2024
- September 2024
- August 2024
- July 2024
- June 2024
- May 2024
- April 2024
- March 2024
- February 2024
- January 2024
- December 2023
- November 2023
- October 2023
- September 2023
- August 2023
- July 2023
- June 2023
- May 2023
- April 2023
- March 2023
- February 2023
- January 2023
- December 2022
- November 2022
- October 2022
- September 2022
- August 2022
- July 2022
- June 2022
- May 2022
- April 2022
- March 2022
- February 2022
- January 2022
- December 2021
- November 2021
- October 2021
- September 2021
- August 2021
- July 2021
- June 2021
- May 2021
- April 2021
- March 2021
- February 2021
- January 2021
- December 2020
- November 2020
- October 2020
- September 2020
- August 2020
- July 2020
- June 2020
- May 2020
- April 2020
- March 2020
- February 2020
- January 2020
- December 2019
- November 2019
- September 2018
- December 2011